LTM4608A
APPLICATIONS INFORMATION
Safety Considerations
The LTM4608A modules do not provide isolation from V IN
to V OUT . There is no internal fuse. If required, a slow blow
fuse with a rating twice the maximum input current needs
to be provided to protect each unit from catastrophic failure.
Layout Checklist/Example
The high integration of LTM4608A makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout con-
siderations are still necessary.
?  Use  large  PCB  copper  areas  for  high  current  path, 
including V IN , GND and V OUT . It helps to minimize the
PCB conduction loss and thermal stress.
?  Place high frequency ceramic input and output capaci -
tors next to the V IN , GND and V OUT pins to minimize
high frequency noise.
?  Place a dedicated power ground layer underneath the 
unit.
?  To minimize the via conduction loss and reduce module 
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
?  Do not put vias directly on the pads, unless they are 
capped.
?  Use a separated SGND ground copper area for com -
ponents connected to signal pins. Connect the SGND
to GND underneath the unit.
Figure 17 gives a good example of the recommended layout.
GND
V OUT
C OUT
C OUT
C OUT
GND
C IN
V IN
C IN
GND
4608A F17
Figure 17. Recommended PCB Layout
4608afd
20
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